bullet CMOS-MEMS Book

 

 

  Title: CMOS-MEMS

  Editors: Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata

  Publisher: John Wiley & Sons

  Hardcover: 620 pages

  Pubdate: 25 March 2005

  ISBN: 3527310800

 

 

CMOS-MEMS book's cover

Editorial Reviews

 

 

Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering successes and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps.

 

Sensor systems, microreactors, nanostructures, nanomachines, functional surfaces, integrated optics, displays, communications technology, biochips, human/machine interfaces, prosthetics, miniaturized medical and surgery equipment and many more opportunities are being explored.

 

This new series, Advanced Micro & Nanosystems (AMN) provides cutting-edge reviews and detailed case studies by top authors from science and industry, covering technologies, devices and advanced systems from the micro and nano worlds, which together have an immense innovative application potential that opens up with control of shape and function from the atomic level right up to the visible world without any technological gaps.

 

In this topical volume, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of MEMS is covered from all angles.

 

The book introduces readers to this field and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first place, rather than having a hybrid solution.

 

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