bullet Sensors & Transducers Journal

    (ISSN 1726- 5479)

 

 

25 Top Downloaded Articles

Editorial Calendar 2007

Submit an Article

Editorial Board

Sensors and Transducers journal's cover

 

Sensors & Transducers Journal 2006

2000-2002 S&T e-Digest Contents

2003 S&T e-Digest Contents

2004 S&T e-Digest Contents

2005 S&T e-Digest Contents

 

 
   

 

 

Vol. 78, Issue 4, April 2007, pp. I-IV

 

Bullet

 

MEMS Based System-on-Chip and System in Package: New Perspectives

 

Sergey Y. Yurish

International Frequency Sensor Association (IFSA),

Tel: +34 696067716, E-mail: editor@sensorsportal.com

 

Abstract: Based on modern MEMS technology achievements new sensors systems architecture on the basis on CMOS System-on-Chip or System in Package (known also as Multi-Chip Module) is considered. The SoC consist of MEMS quartz oscillators, MEMS sensors and universal frequency-to-digital converter. It was illustrated how modern MEMS technology make true some past predictions concerning technological and cost factors for moving from the traditional analog (voltage and current) sensor signal domain to the frequency-time signal domain.

 

Keywords: MEMS technology, sensors systems, system-on-chip, system in package, multi-chip module, MEMS quartz oscillators, MEMS sensors, universal frequency-to-digital converter

 

Acrobat reader logo Click <here> or title of paper to download the full pages article (368 K)

 

 

 

 


1999 - 2007 Copyright , International Frequency Sensor Association (IFSA). All Rights Reserved.


Home - News - Links - Archives - Tools - Standardization - Patents - Marketplace - Projects - Wish List - Subscribe - Search - e-Shop - Membership

 Members Area -Sensors Portal -Training Courses - S&T Digest - For advertisers - Bookstore - Forums - Polls - Sensor Jobs - Site Map