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Vol. 161, Issue 12, December 2013, pp. 311-317




Modal and Harmonic Response Analysis of PBGA and S-N Curve Creation of Solder Joints
1 Yu Guo, 1 Kailin Pan, 1, 2 Xin Wang, 1, 2 Tao Lu and 2 Bin Zhou

1 School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology,

1 Jinji Road, Guilin, 541004, China

2 Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI 110 Dongguanzhuang Road,

Tianhe District, Guangzhou, 510000, China
E-mail: gac_guo@foxmail.com, panklphd@gmail.com, zhoubin722@163.com


Received: 18 September 2013   /Accepted: 22 November 2013   /Published: 30 December 2013

Digital Sensors and Sensor Sysstems


Abstract: In recent years, with the rapid development of the microelectronics industry and the wide application of high-density packaging of electronic products, the environmental requirements for electronic products become harsh increasingly. In addition to the thermal stress, the micro-assembly device will also withstand the effects of vibration and shock with different forms, which may aggravate the elastic and plastic deformation of solder. So that increasing the accumulation of fatigue damage and even make entire electronic product failure. This paper focus on the vibration reliability of PBGA, the model test is conducted in order to ascertain the natural frequency and damping ratio, amplification coefficient, and then sine sweep test at different excitation conditions can be carried out until a solder joint become failure. The finite element model is developed by the ANSYS software. By comparing the results, the stress and strain distribution of failure joint in the first-order frequency range are attained. Finally, a numerical simulation method to obtain the curve of stress and number of the cycle to fail is developed in this paper.


Keywords: Harmonic response analysis, Modal analysis, PBGA, S-N curve.


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