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Vol. 166, Issue 3, March 2014, pp. 224-228

 

Bullet

 

Based on Hot Embossing Lithography Preparation of High-Precision Micron-Level Pattern
 

1* Sumei Jia, 1 Yan Li, 2 Feng Wang, 1 Hongjun Guo

1 College of Information Engineering, Handan College, Room 401, Unit 2, Block 5, Tongren Garden, Hanshan District, Handan City, Hebei Province, 056001, China
2 E&A College, Hebei Normal University of Science & Technology, Qinhuangdao, 066004, China
1 Tel.: 13603306856

E-mail: jiasumei0920@163.com

 

Received: 25 December 2013 /Accepted: 28 February 2014 /Published: 31 March 2014

Digital Sensors and Sensor Sysstems

 

Abstract: Compared with UV embossing and micro-contact imprinting, hot embossing technology is the first to be used in nano-imprint lithography, and is access to copying the parallel structure in micro-nano-scale at low cost and relatively faster speed. This paper explores which factors influence some pattern transferring accuracy appearing in the experiment: the adhesion between mold and polymethyl methacrylate, the main factors of affecting embossing plastic flow including imprinting pressure, temperature, time and the plastic filling effect affected by mold pattern, the effect on the viscosity of embossing adhesive by temperature and the effect on the viscosity of embossing adhesive by embossing pressure and time. The parameters affecting the accuracy of pattern transfer are optimized via the IntelliSuite simulation designed specifically for Micro-electro-mechanical systems. A micro-level pattern with high-precision by the use of nano-imprint Obduct machine is eventually made.

 

Keywords: Nano-imprint lithography, Hot embossing lithography, MEMS, IntelliSuite, Micro-scale patter.

 

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