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Vol. 115, Issue 4, April 2010, pp. 135-150

 

Bullet

 

Silicon Die Self-alignment on a Wafer: Stable and Unstable Modes

 

1Jean BERTHIER, 2Kenneth BRAKKE, 3François GROSSI, 3Loïc SANCHEZ, 3Léa DI CIOCCIO

1 CEA-LETI-Minatec, Department of Biotechnology, 17 avenue des Martyrs, 38954, Grenoble, France

Tel.: +33 4 3878 3551

2 Mathematics Department, Susquehanna University, Selinsgrove, PA 17870-1164, USA

3 CEA-LETI-Minatec, Department of Nanotechnology,

17 avenue des Martyrs, 38954, Grenoble, France

Tel.: +33 4 3878 3762

E-mail: jean.berthier@cea.fr, lea.dicioccio@cea.fr

 

 

Received: 15 October 2009   /Accepted: 20 April 2010   /Published: 27 April 2010

 

Abstract: 3D integration is the key to advanced microelectronic systems. Die-to-wafer assembly is a necessary step to reach full integration. Self-assembly methods are promising due to their parallel aspect which overcomes the main difficulties of the current techniques. The aim of this work is the understanding of the mechanisms of self-alignment with an evaporating droplet technique and the investigation the stable and unstable modes. Using the Surface Evolver software, we analyze the causes for misalignments of the system and their evolution.

 

Keywords: Self-alignment, Misalignment, Silicon die, Surface energy minimization

 

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