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Vol. 205, Issue 10, October 2016, pp. 63-71

 

Bullet

 

Out-of-plane Characterization of Silicon-on-insulator Multiuser
MEMS Processes-based Tri-axis Accelerometer
 

1 Sujatha L., 1 Kalaiselvi S. and 2 Vigneswaran N.

1 Centre for MEMS & Microfluidics, Rajalakshmi Engineering College, Chennai 602105 India
2 Faculty of Electrical and Electronics Engineering, University Malaysia Pahang, Pekan Malaysia
1 Tel.: 044-37181044, fax: 04437181113

E-mail: sujatha.l@rajalakshmi.edu.in

 

Received: 12 October 2016 /Accepted: 28 October 2016 /Published: 31 October 2016

Digital Sensors and Sensor Sysstems

 

Abstract: In this paper, we discuss the analysis of out-of-plane characterization of a capacitive tri-axis accelerometer fabricated using SOI MUMPS (Silicon-on Insulator Multi user MEMS Processes) process flow and the results are compared with simulated results. The device is designed with wide operational 3 dB bandwidth suitable for measuring vibrations in industrial applications. The wide operating range is obtained by optimizing serpentine flexures at the four corners of the proof mass. The accelerometer structure was simulated using COMSOL Multiphysics and the displacement sensitivity was observed as 1.2978 nm/g along z-axis. The simulated resonant frequency of the device was found to be 13 kHz along z axis. The dynamic characterization of the fabricated tri-axis accelerometer produces the out-of-plane vibration mode frequency as 13 kHz which is same as the simulated result obtained in z-axis.

 

Keywords: Tri-Axis accelerometer, SOIMUMPS, High bandwidth, Vibration measurement, Resonant frequency.

 

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