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Vol. 11, Special Issue, April 2011, pp.56-63

 

Bullet

Mechanical Robustness of FPA in a-Si Microbolometer with Fine Pitch

 

1Hee Yeoun Kim, 1Kyoung Min Kim, 1Byeong Il Kim, 2Won Soo Jang, 2Tae Hyun Kim and 2Tai Young Kang

1National Nanofab Center (NNFC), 335 Gwahangro, Yuseoung-gu, Daejeon, Korea,

Tel.: +82-42-879-9721

2OCAS Co., Korea, 1271-11, Gyunggi Technopark 409, Korea

Tel.: +82-31-500-4500

E-mail: hyeounkim@nnfc.com, kkm@nnfc.com, kbiset@nnfc.com, wsjang@ocas.co.kr, thkim@ocas.co.kr, tykang@ocas.co.kr

 

 

Received: 10 December 2010   /Accepted: 15 March 2011   /Published: 5 April 2011

 

Abstract: Microbolometer array sensors with fine pitch pixel arrays have been implemented using amorphous silicon supported by two contact pads. Simple beam test structures were fabricated and characterized for the purpose of designing a focal plane with geometrical flatness. As the beam length decreased, the effect of beam width on the bending was minimized. Membrane deformation of focal plane in a real pixel showed downward curvature by residual stress of a-Si and Ti layer. The tilting deformation was caused by the misalign effect of contact pad and confirmed by FEA (Finite Element Analysis) simulation results. The electro-optical properties of bolometer have been measured to be noise equivalent temperature difference (NETD) = 145 mK, temperature Coefficient of Resistance (TCR) = −2 %/K, and thermal time constant = 1.99 ms.

 

Keywords: Microbolometer, Amorphous silicon, IR sensor, Residual stress

 

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