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Vol. 13, Special Issue, December 2011, pp.117-123

 

Bullet

 

Improved Nanoreinforced Composite Material Bonds with Potential Sensing Capabilities

 

1 David STARIKOV, 1 Clyde A. PRICE, 1 Michael S. FISCHER, 2 Abdelhak BENSAOULA, 2 Farouk ATTIA, 3 Thomas A. GLENN,
4 Mounir BOUKADOUM

1 Integrated Micro Sensors Inc, 10814 Atwell Dr, Houston, TX 77096, USA

Tel.: ++713-748-7926, fax: ++713-729-2867

2 University of Houston, 724 Science & Research Building 1, TX 77204, USA

Tel.: ++713-743-3621, fax: 713-747-7724

3 Ultimate Composites Analysis, 276 Wildwood Avenue, Piedmont, CA 94610

Tel.: ++510-251-8830, fax: ++510-251-0608

4 Université du Québec à Montréal, Case Postale 8888, Succursale Centre-Ville

Montréal (Québec), H3C 3P8, Canada

Tel.: ++514-987-3000

E-mail: dstarikov@imsensors.com, bens@uh.edu, tglenn@ucanalysis.com, boukadoum.mounir@uqam.ca

 

 

Received: 29 June 2011   /Accepted: 16 November 2011   /Published: 28 December 2011

Handbook of Laboaratory Measurements book

 

Abstract: Dramatic increase in the bond strength of composite/adhesive interfaces of nanoreinforced composite material joints and structures has been achieved using laser-assisted fabrication of Micro-Column Arrays (MCA) on the surface of the two materials prior to bonding. Several advantages of the MCA technology resulting in drastic improvement of virtually any bond include: interlocking of the adhesive material between micro columns, about 10-fold increase of the specific surface area, inherent elasticity of the micro columns, enhanced resistance to hygrothermal failures, substantially improved wettability, and control over the surface chemistry. In order to take advantage of the unique electrical properties of both composite materials and the Carbon Nanotube (CNT) reinforced adhesive, experiments were performed to evaluate the potential of using electrical response of the bonded material to applied stress.

 

Keywords: Nanoreinforced composites, Laser-assisted surface modification, Micro-column arrays, Dissimilar materials bonding, Electrical properties, Sensing capabilities

 

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