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Vol. 16, Special Issue, November 2012, pp. 68-74

 

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Numerical Simulation of the Gap Flow Field for CEDMMG Compound Machining Engineering Ceramics

 

Renjie Ji, Yonghong Liu, Chao Zheng, Fei Wang, Yanzhen Zhang,
Yang Shen, Baoping Cai

College of Electromechanical Engineering, China University of Petroleum,

Qingdao, Shandong 266580 P. R. China.

Tel.: +86-532-86983303, fax: +86-532-86983300

E-mail: jirenjie202@yahoo.cn

 

Received: 11 September 2012   /Accepted: 11 October 2012   /Published: 20 November 2012

Digital Sensors and Sensor Sysstems

 

Abstract: Engineering ceramics are introduced to satisfy the requirements of high-precision manufacturing industries. However, they are difficult to machine due to their high strength, high hardness, high toughness and high thermal resistance. In this paper, the circumferential electrical discharge milling and mechanical grinding (CEDMMG) compound machining process is presented. The high material removal rate and good surface quality of machining engineering ceramics with the compound process can be obtained. Moreover, the gap flow field of the compound process is numerically simulated based on the liquid-solid two-phase flow theory. The results show that the working fluid flow can be accelerated, and the machining debris can be ejected timely due to the rapid rotation of the tool, so the process performance can be enhanced.

 

Keywords: Numerical simulation, Gap flow field, Engineering ceramics, Compound machining

 

 

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