Bullet Sensors & Transducers e-Digest, Vol. 78, Issue 4, April 2007: Product News

    (ISSN 1726- 5479)

 

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Industry First Compact Reverse Pulse Plating Controller for Research and Development Applications in MEMS and Nanotechnology

 

Laguna Beach, CA March 31, 2007 - Kebaili Corporation announced the release of the CPG-500 Series, the industry first compact current pulse generator, specifically designed for electrodeposition applications, such as (direct current) DC plating, pulse plating, and periodic reverse pulse plating for a variety of applications in MEMS and nanotechnology.

 

According to Dr. Mo Kebaili, Chief Technology Officer of Kebaili Corporation, commercially available reverse pulse plating systems and potentiostat/galvanostat are typically large and usually not optimized for cleanroom environments. The CPG-500 was ergonomically designed in a compact unit, and optimized for end-user applications in MEMS and nanotechnologies.

 

The CPG-500 power requirement is 100-240 V AC at 50-60 Hz, is microprocessor-controlled, is fully user programmable, and is self-contained with no need to connect to a PC. The CPG-500 is very user friendly, it can be programmed for DC plating, pulse plating, or reverse pulse plating.

 

CPG-500 can generate forward and reverse current pulses from 1 microamp to 350 milliamps, with a minimum pulse width of 1 msec. The compliance voltage is 10 Volts. The user can program 10 pulse waveforms and store the recipes in the CPG-500 internal non-volatile memory.

 

Kebaili CPG-500 offers impressive specifications, and is cost-effective for a wide range of research and development applications, and laboratory requirements, such as:

  • Reducing porosity and intrinsic stress, improving uniformity, increasing hardness and decreasing grain size of electroplated thin-films for physical, chemical, biological transducers and microsensors;

  • Silicon wafer through holes void free metallization of high aspect ratio microvias in microelectronic and microtechnology applications;

  • Metallic and alloy nanowires synthesis by electroplating through anodized aluminum templates in nanotechnology applications;

  • Micro-molds, micro-coils and metallic microstructures fabrication.

  • Electrodes fabrication for thin-film-based micro-batteries;

  • Micro-metallization in microfluidic devices and high aspect ratio micro-channel in biochip applications;

  • Platinum catalyst electrodeposition on polymeric exchange membrane (PEM) in micro fuel cell applications;

  • Microstructures fabrication for micro analytical instruments, and micro chemical plants;

  • Electrochemical deposition of bismuth telluride thin-films for micro-thermo electric cooling applications;

  • Electrodeposition of cobalt in anodized aluminum template as a precursor catalyst for carbon nanotubes synthesis by chemical vapor deposition (CVD).

Pulse plating controller

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Contact:

 

Mo Kebaili, Ph.D.

Chief Technology Officer

Kebaili Corporation

316 Magnolia Drive

Laguna Beach, California

92651-1752 USA

Tel: 949-494-5892

E-mail: mo@kebaili.com

 

 

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