Bullet Sensors & Transducers e-Digest, Vol. 76, Issue 2, February 2007: Market Trends

    (ISSN 1726- 5479)

 

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3D Integration Will Affect the IC, MEMS and Image Sensors Markets

 

The technical issues for innovative 3D packaging at the wafer level are close to be solved. Yole’s latest report highlights the market drivers for 3D packaging technologies, the status of developments, how it will impact the semiconductor food chain. It covers as well equipments market forecasts and technical analyses of the different solutions with extensive exclusive technical explanation, figures and abstracts.

 

Semiconductor chips face constant pressure for increased performances while still decreasing their size and at the same time their packages must be able to accommodate new functionalities. The ever-expanding consumer electronics market is a particularly strong driver of packaging innovations such as 3D ICs. Today wire bonding is limited in density and performances so 3D stacking with micro-vias (or TSV, “through-Si vias”) seems to be unavoidable in the future for miniaturization first and increased performances after.

 

3D integration will use technologies originally developed for MEMS technology but for different markets. It was analyzed in the report that portable applications are a strong market driver for 3D integration. Stacking memories, stacking memories and logic, image sensors with µP and FPGAs will be the first mass market applications.

 

In 2010, we forecast that 1 billion of Flash memories will be stacked with TSVs “says Eric Mounier, in charge of MEMS and Advanced Packaging technologies at Yole .

 

3D is the most “integrated” approach and is an enabling technology platform applicable to digital and mixed signal electronics, wireless, electro-optical, MEMS, sensors, smart imagers, displays and other devices. There are however strong challenges. They are: thermal management; reliable co-design and simulation tools, industrial wafer-to-wafer bonding tools, low-cost through-wafer via structures and via fill processes. The different technical solutions were analyzed and compared in the report.

Market diagram

Click picture to enlarge. Magnifier

Contact:

 

Dr. Eric Mounier

Yole Développement

45 Rue Sainte Geneviève,

69006 Lyon, France

Tel.: +33 472 83 01 80

E-mail: Khamassi@yole.fr

 

 

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