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   (ISSN 1726-6017)

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This monthly e-newsletter, written by the editors of Sensors & Transducers Magazine (ISSN 1726-5479), delivers the product and research news you asked for, and updates you on happenings in the sensor science and industry. Who should read this Newsletter ? All who are interested in the newest information and trends in sensors, transducers, MEMS and sensor instrumentation, including DAQ.

 

IFSA Newsletter (ISSN 1726-6017), No.9, September 2006

Sponsored Links:

 

Bullet In this Issue:

 

1.   IEEE Workshop on Intelligent Data Acquisition and Advanced Computing Systems

2.   Sensors & Transducers Magazine (e-Digest), No.9, September 2006

3.   Sensors Web Portal Up-dates Briefs

4.   New Recently Published Sensors Books

5.   Monthly Web Spots

6.   Global MEMS/Microsystems - Markets and Opportunities

7.   Subscriber services

8.   Additional Information, Comments, Suggestions

 

Plus lots more information to be found on Sensors Web Portal: http://www.sensorsportal.com

 


Bullet  IEEE 4th International Workshop on Intelligent Data Acquisition and

      Advanced Computing Systems: Technology and Applications

      (IDAACS'2007), Dortmund, Germany, 6-8 September 2007

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The main goal of the IDAACS'2007 is to provide a forum for high quality reports on the state-of-the-art Theory, Technology and Applications of Intelligent Data Acquisition and Advanced Computer Systems as used in measurement, automation, and scientific research, in industry and business. Rapid developments in these areas have resulted in more intelligent, sensitive, and accurate methods of data acquisition and data processing in manufacturing, in the environmental monitoring, in medical systems and in the laboratory practice. Advanced methods have been developed to enhance the measurement of information for automation, in process inspection, quality control, diagnostics, and other processes. The importance of IDAACS'2007 is its vision to establish scientific contacts between research teams and scientists from different countries for future joint research collaborations. This interaction is proved by the successful activity of the scientists after first, second and third IDAACS Workshops, which were hold in Foros, Crimea, Ukraine, and Lviv, Ukraine and Sofia, Bulgaria respectively.

 

 

The topics to be covered include, but are not limited to, the following:

 

1.  Advanced Instrumentation and Data Acquisition Systems

2.  Intelligent Distributed Systems and Remote Control

3.  Virtual Instrumentation Systems

4.  Advanced and High Performance Computing Systems

5.  Cluster and Grid Technologies, Parallel Software Tools and Environments

6.  Embedded Systems

7.  Artificial Intelligence and Neural Networks for Advanced Data Acquisition and Computing Systems

8.  Advanced Mathematical Methods for Data Acquisition and High Performance Computing

9.  Industrial Signal and Image Processing

10.Data Analysis and Dynamic Modelling

11.Intelligent Information and Retrieval Systems

12.Robotics and Autonomous Systems

13.Information Computing Systems for Education and Commercial Applications

14.Bio-Informatics and Homeland Security

15.Safety, Security and Reliability of Software

16.Data Acquisition - Special Stream on Risk Management and Insurance

17.Wireless Systems - Special Stream

 

Deadlines:

 

Abstract submission: 30 January 2007

Notification of acceptance 30 March 2007

Camera ready paper submission and Registration 30 May 2007

 

For more information please see: www.idaacs.net


Bullet Sensors & Transducers e-Digest (ISSN 1726-5479), Vol. 71, No. 9,September 2006

     

Product News

Sensors Market

Standardization

Sensors & Transducers Journal's cover

  

The deadline for articles, press releases and sponsored White Papers for the next  issue of S&T e-Digest No.10, Vol.72, October 2006 is 15 October 2006. You can submit your article or press release online. For more information and instructions of preparation click <here>.

 


Bullet Sensors Web Portal Up-Date Briefs

 

News:

  • New issue of Sensors & Transducers e-Digest, Vol.71, Issue 9, September 2006 is in the DIGEST section with products and business news

  • Online Store with Scopemeters from Fluke

Up-dated:


Bullet New Sensor Books

 

Piezoelectric Transducers for Vibration Control and Damping, by S.O. Reza Moheimani and Andrew J. Fleming

  

Vibration with Control

by D.J. Inman

 

Book's cover

Publisher: Springer

Hardcover: 271 pages

Pubdate: 2 June 2006

ISBN: 1846283310

 

More details ...

Vibration with Control book's cover

Publisher: John Wiley & Sons

Hardcover: 338 pages

Pubdate: 6 October 2006

ISBN: 0470010517

 

More details ...

 

 

For more sensors related books please visit our Online Bookstore

 


Bullet Monthly Web Spots

 

The COMSOL Group's web site provides software solutions for multiphysics modeling with easy-to-use application interfaces, unlimited multiphysics capabilities, and a fully flexible model setup. There are micro sensors and MEMS model galleries.

 

COMSOL Group's web site

COMSOL Group's web site

Micro Sensors Model Gallery

MEMS Model Gallery

 

 


Bullet Global MEMS/Microsystems - Markets and Opportunities

 

Micro-electromechanical systems (MEMS) include products such as automobile airbag systems, display systems and inkjet cartridges.The worldwide MEMS systems market reached $48 billion in 2005, and is expected to rise to $72 billion by 2008 and $95 billion by 2010, for a compound annual growth rate (CAGR) of about 15 percent over the five-year period.

  • Globally the MEMS device market was $5.26 billion last year and is forecast to grow to $9.86 billion in 2010, with a 13 percent CAGR.

  • The MEMS equipment market was $631 million worldwide in 2005, and is expected to expand to $758 million in 2008 and $861 million in 2010. The five-year CAGR forecast for MEMS equipment is 6 percent.

  • MEMS materials can be divided into substrates and chemicals and other materials.Together these markets totaled $385 million in 2005 and are forecast to be $771 million in 2010. MEMS materials are expected to grow at a five-year CAGR of 15 percent through 2010.

The MEMS industry is highly fragmented with a large number of device manufacturers worldwide in a wide variety of application fields. Many start-ups and small and medium-sized companies participate in the industry.

  • The top 30 MEMS device manufacturers accounted for about 84% ofMEMS device sales in 2005.

  • No one device manufacturer has reached the billion dollar sales mark as of yet, and average revenue for a top 30 manufacturer is about $147 million.

In 2005 more than half of MEMS devices by value ($2.6 billion) were produced in North America. Japan is the next largest MEMS producing region, accounting for one-fifth of the total MEMS device revenues ($1.1 billion) in 2005. About 16% of MEMS sales, over $815 million, originated from European production sites last year. Singapore is also a significant manufacturing location for MEMS manufacturers such as STMicroelectronics, with 11% of MEMS device revenues attributed to Singapore fabs.

 

Front-end manufacturing equipment accounts for 53% of the MEMS equipment market today, assembly/packaging and test equipment 31%, and research and development (R&D) equipment the remaining 16%. Etch, wafer bonding, assembly/packaging, and test equipment are expected to experience the highest growth over the next five years.

 

MEMS substrate materials are the largest materials segment and include silicon, quartz, glass, polymers and others.The total MEMS substrate market is forecast to grow from $264 million in 2005 to $570 million by 2010, for a CAGR of over 17 percent over the five-year period. Packaging coating materials (SU-8) are a relatively new materials market, but are forecast to grow to $3 million in 2010, for a CAGR of 50 percent over the five-year period.

 

 


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Bullet Addition Information

 

1) Our next Newsletter will be published at the end of October 2006. Interested in sponsoring IFSA Newsletter ? Please contact us mailto: sales@sensorsportal.com

 

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