Optimal design on SAW sensor for wireless pressure measurement based on reflective delay line Pages 2-6 Wen Wang, Keekeun Lee, Insang Woo, Ikmo Park and Sangsik Yang
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Preparation of tungsten oxide–tin oxide nanocomposites and their ethylene sensing characteristics Pages 7-11 Yootana Pimtong-Ngam, Sirithan Jiemsirilers and Sitthisuntorn Supothina
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Thermal analysis of micro cantilevers integrated with heaters for low power nano-data-storage application Pages 12-16 Caroline
Sun-Yong Lee, Sung-Geun Kim, Suk-Yong Jeong, Sung-Hoon Ahn, Won-Hyeog
Jin, Sung-Soo Jang, Il-Joo Cho, Young-Sik Kim and Hyo-Jin Nam
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Low cost thin film based piezoresistive MEMS tactile sensor Pages 17-22 A. Wisitsoraat, V. Patthanasetakul, T. Lomas and A. Tuantranont
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An optimized MEMS-based electrolytic tilt sensor Pages 23-30 Ho Jung, Chang Jin Kim and Seong Ho Kong
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Detecting boundary-layer separation point with a micro shear stress sensor array Pages 31-35 Kui Liu, Weizheng Yuan, Jinjun Deng, Binghe Ma and Chengyu Jiang
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3D arrays of SERS substrate for ultrasensitive molecular detection
Pages 36-41 R.Z. Tan, A. Agarwal, N. Balasubramanian, D.L. Kwong, Y. Jiang, E. Widjaja and M. Garland
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A GaAs acoustic sensor with frequency output based on resonant tunneling diodes
Pages 42-46 Binzhen Zhang, Jian Wang, Chenyang Xue, Wendong Zhang and Jijun Xiong
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Mechanical tuning of two-dimensional photonic crystal cavity by micro Electro mechanical flexures
Pages 47-52 O. Levy, B.Z. Steinberg, A. Boag, S. Krylov and I. Goldfarb
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Doped and dedoped polyaniline nanofiber based conductometric hydrogen gas sensors
Pages 53-57 A.Z. Sadek, W. Wlodarski, K. Kalantar-Zadeh, C. Baker and R.B. Kaner
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Function-inspection scheme for an injured peripheral nerve using a polymer based microelectrode array
Pages 58-65 Yong-Ho Kim, Chungkeun Lee, Kang Min Ahn, Yong-Jun Kim and Myoungho Lee
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Finite element analysis of ring strain sensor
Pages 66-69 B. Chen, X. Wu and X. Peng
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On the micromechanics of micro-cantilever sensors: Property analysis and eigenstrain modeling
Pages 70-77 Alexander M. Korsunsky, Suman Cherian, Roberto Raiteri and Rüdiger Berger
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Experimental investigation and visualization on capillary and boiling limits of micro-grooves made by different processes
Pages 78-87 Shao-Wen Chen, Jui-Ching Hsieh, Cheng-Tai Chou, Hung-Hui Lin, Sheng-Chih Shen and Ming-Jye Tsai
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Surface micromachined accelerometer using ferroelectric substrate
Pages 88-94 Seiji Aoyagi, Sho Kumagai, Daiichiro Yoshikawa and Yuichi Isono
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Flapping wings with PVDF sensors to modify the aerodynamic forces of a micro aerial vehicle
Pages 95-103 Lung-Jieh Yang, Cheng-Kuei Hsu, Jen-Yang Ho and Chao-Kang Feng
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Short-circuit measurement by Seebeck current detection of a single thermocouple and its application
Pages 104-110 Seung Seoup Lee and Mitsuteru Kimura
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Planar type micromachined probe with low uncertainty at low frequencies
Pages 111-117 Jung-Mu Kim, Sungjoon Cho, Namgon Kim, Jeonghoon Yoon, Jeiwon Cho, Changyul Cheon, Youngwoo Kwon and Yong-Kweon Kim
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Diaphragm deflection control of piezoelectric ultrasonic microsensors for sensitivity improvement
Pages 118-123 Kaoru Yamashita, Hiroki Nishimoto and Masanori Okuyama
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Production of protein microarrays for cell culture using electrostatic deposition
Pages 124-130 Hyuneui Lim, Dongsoo Kim, Wonhee Lee, Yongdoo Park and Kyuback Lee
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Olfactory and taste cell sensor and its applications in biomedicine
Pages 131-138 Ping Wang, Qingjun Liu, Ying Xu, Hua Cai and Yan Li
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DNA purification silicon chip
Pages 139-144 Hong
Miao Ji, Victor Samper, Yu Chen, Wing Cheong Hui, Hui Jen Lye, Fatimah
Bte Mustafa, Ai Cheng Lee, Lin Cong, Chew Kiat Heng and Tit Meng Lim
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| Materials and Technology Section |
Anti-adhesive effects of diverse self-assembled monolayers in nanoimprint lithography
Pages 145-151 Chih-Wei Wu, Yung-Kang Shen, Sheng-Yu Chuang and C.S. Wei
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Preparation and characterization of wafer scale lead zirconate titanate film for MEMS application
Pages 152-157 Jian Lu, Yi Zhang, Takeshi Kobayashi, Ryutaro Maeda and Takashi Mihara
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Ferroelectric poly(vinylidene fluoride-hexafluoropropylene) thin films on silicon substrates
Pages 158-161 Xujiang He, Kui Yao and Bee Keen Gan
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Glass-based microfluidic device fabricated by parylene wafer-to-wafer bonding for impedance spectroscopy Pages 162-171 Daniel P. Poenar, Ciprian Iliescu, Mihaela Carp, Ah Ju Pang and Kwong Joo Leck
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A circular microchannel integrated with embedded sprial electrodes used for fluid transportation
Pages 172-177 Lung-Jieh Yang, Jiun-Min Wang, Kai-Chung Ko, Wen-Pin Shih and Ching-Liang Dai
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Thermomechanical tensile characterization of Ti–Ni shape memory alloy films for design of MEMS actuator
Pages 178-186 Takahiro Namazu, Akinobu Hashizume and Shozo Inoue
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A 5.8-GHz VCO with CMOS-compatible MEMS inductors
Pages 187-193 Sheng-Hsiang Tseng, Ying-Jui Hung, Ying-Zong Juang and Michael S.-C. Lu
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A novel electromagnetic elastomer membrane actuator with a semi-embedded coil
Pages 194-202 Hung-Lin Yin, Yu-Che Huang, Weileun Fang and Jerwei Hsieh
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A novel artificial sphincter prosthesis driven by a four-membrane silicon micropump
Pages 203-209 Alexander
F. Doll, Martin Wischke, Andreas Geipel, Frank Goldschmidtboeing, Olaf
Ruthmann, Ulrich T. Hopt, Hans-Juergen Schrag and Peter Woias
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A novel constant delivery thermopneumatic micropump using surface tensions
Pages 210-215 Do Han Jun, Woo Young Sim and Sang Sik Yang
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A novel polydimethylsiloxane microfluidic system including thermopneumatic-actuated micropump and Paraffin-actuated microvalve
Pages 216-220 Jong-Chul Yoo, Y.J. Choi, C.J. Kang and Yong-Sang Kim
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Joule heating and its effects on electrokinetic transport of solutes in rectangular microchannels
Pages 221-232 Gongyue Tang, Deguang Yan, Chun Yang, Haiqing Gong, Cheekiong Chai and Yeecheong Lam
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An intelligent bipolar actuation method with high stiction immunity for RF MEMS capacitive switches and variable capacitors
Pages 233-236 Hiroaki Yamazaki, Tamio Ikehashi, Tatsuya Ohguro, Etsuji Ogawa, Kenji Kojima, Kazunari Ishimaru and Hidemi Ishiuchi
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| Systems/Applications Section |
Experimental study of flow characteristics and mixing performance in a PZT self-pumping micromixer
Pages 237-244 H.J. Sheen, C.J. Hsu, T.H. Wu, H.C. Chu, C.C. Chang and U. Lei
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The 2.4 GHz biotelemetry chip for healthcare monitoring system
Pages 245-251 Chen-Ming Hsu, Wei-Yin Liao, Ching-Hsing Luo and Tse-Chuan Chou
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Cell differentiation guidance using chemical stimulation controlled by a microfluidic device
Pages 252-258 Yuta Nakashima and Takashi Yasuda
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Wafer level fabrication of hermetically sealed microcavity with robust metal interconnects for chip cooling application
Pages 259-264 Chao-Tsun Kou, Tzu-Yuan Chao, I.Ta Chiang and Y.T. Cheng
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Optimization of a pulsed carbon dioxide snow jet for cleaning CMOS image sensors by using the Taguchi method
Pages 265-271 Sheng-Chung Yang, Keng-Shiang Huang and Yu-Cheng Lin
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Synthesis and characterization of patterned and nonpatterned copper and nickel nanowire arrays on silicon substrate
Pages 272-280 Gaurav Sharma, Vaidyanathan Kripesh, Mong Chea Sim and Chorng Haur Sow
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Sloping profile and pattern transfer to silicon by shape-controllable 3-D lithography and ICP Pages 281-286 Jin-Wan Jeon, Jun-Bo Yoon and Koeng Su Lim
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3D glass fabrication utilizing electric field and heat treatment induced image mirroring
Pages 287-292 Pan Kyeom Kim, Min Soo Kim and Geunbae Lim
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Laser fabrication of high aspect ratio thin holes on biodegradable polymer and its application to a microneedle
Pages 293-302 Seiji Aoyagi, Hayato Izumi, Yuichi Isono, Mitsuo Fukuda and Hiroshi Ogawa
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Robust replaceable MEMS packaging for rotor blade integration
Pages 303-309 Christian Gradolph, Thomas Ziemann, Gerhard Müller, Jürgen Wilde and Alois Friedberger
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Design and fabrication of polymer microfluidic substrates using the optical disc process
Pages 310-317 Chun-Han Wu, Chun-Hwa Chen, Kuo-Wei Fan, Wen-Syang Hsu and Yu-Cheng Lin
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Synthesis and luminescence properties of Sr3MgSi2O8:Eu2+,Dy3+ by a novel silica-nanocoating method
Pages 318-322 Wen Pan and Guiling Ning
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Development of dual-etch via tapering process for through-silicon interconnection
Pages 323-329 Ranganathan Nagarajan, Krishnamachar Prasad, Liao Ebin and Balasubramanian Narayanan
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Study peeling strength of tape carrier packaging and chip scale packaging
Pages 330-336 Yu-Tang Yen and Yu-Cheng Lin
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Development of hafnium oxynitride dielectrics for radio-frequency-microelectromechanical system capacitive switches
Pages 337-342 Yi Zhang, Jian Lu, Kazumasa Onodera and Ryutaro Maeda
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Self-alignment of microchips using surface tension and solid edge
Pages 343-349 C. Gary Tsai, C. Max Hsieh and J. Andrew Yeh
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Three-dimensional integration scheme with a thermal budget below 300 °C
Pages 350-355 P. Benkart, A. Munding, A. Kaiser, E. Kohn, A. Heittmann, H. Huebner and U. Ramacher
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Reprint of “Fabrication of nano-structures using inverse-μCP technique with a flat PDMS stamp”
Pages 356-363 Janggil Kim, Nobuyuki Takama and Beomjoon Kim
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