Journal : SENSORS AND ACTUATORS A: PHYSICAL
Journal : SENSORS AND ACTUATORS A: PHYSICAL
ISSN : 0924-4247 Vol./Iss. : 71 / 1-2
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CMOS compatible temperature sensor based on the lateral bipolar transistor for very wide temperature range
applications,
Bianchi , R.A. pp.: 3-9 CMOS temperature sensors and built-in test circuitry for thermal testing of ICs Sze'kely , V. pp.: 10-18 Thermo-optic effect exploitation in silicon microstructures Cocorullo , Giuseppe pp.: 19-26 A temperature-controlled smart surface-acoustic-wave gas sensor van der Meer , Paul R. pp.: 27-34 Vertically driven microactuators by electrothermal buckling effects Lin , Liwei pp.: 35-39 Subsurface microscopy of biased metal-oxide--semiconductor field-effect-transistor structures: photothermal and electroreflectance images, Batista , J.A. pp.: 40-45 Lock-in contact thermography investigation of lateral electronic inhomogeneities in semiconductor devices Breitenstein , O. pp.: 46-50 Application of inverse heat conduction methods in temperature monitoring of integrated circuits Janicki , Marcin pp.: 51-57 Some critical conditions of the thermal breakdown in semiconductors Somogyi , K. pp.: 58-62 Modelling solid-state linear X-ray sensors using a mixed-signal hardware description language Borra`s , G. pp.: 63-69 Novel sapphire fiber thermometer using fluorescent decay Shen , Yonghang pp.: 70-73 Parasitic charging of dielectric surfaces in capacitive microelectromechanical systems (MEMS) Wibbeler , Ju"rgen pp.: 74-80 Silicon microchambers for DNA amplification Daniel , J.H. pp.: 81-88 Piezoelectric and pyroelectric transient signal analysis for detection of the temperature of a contact object for robotic tactile sensing, Dargahi , J. pp.: 89-97 A low pressure micromachined flow modulator Robertson , J.K. pp.: 98-106 Optimal design and noise considerations of CMOS compatible IR thermoelectric sensors Socher , E. pp.: 107-115 New design of matching layers for high power and wide band ultrasonic transducers Kim , Yeon pp.: 116-122 Silicon/glass wafer-to-wafer bonding with Ti/Ni intermediate bonding Xiao , Zhi-Xiong pp.: 123-126 A study on the design of a shear wave ultrasonic transducer considering the effect of the side layer Han , Kyohoon pp.: 127-132 The wafer flexure technique for the determination of the transverse piezoelectric coefficient (d31) of PZT thin films Shepard Jr. , J.F. pp.: 133-138 Improved preparation procedure and properties for a multilayer piezoelectric thick-film actuator Yao , Kui pp.: 139-143 High aspect ratio polymer microstructures and cantilevers for bioMEMS using low energy ion beam and photolithography, Lee , L.P. pp.: 144-149 Piezoelectric cantilever voltage-to-frequency converter Lee , Seung S. pp.: 153-157 |
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