Journal : SENSORS AND ACTUATORS A: PHYSICAL
ISSN : 0924-4247 Vol./Iss.: 99/1-2
Date : 30-Apr-2002
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Polysilicon: a versatile material for microsystems, P.J. French, pp 3-12. Abstract.
Thermal isolation in microsystems with porous silicon, V. Lysenko, S. Perichon, B. Remaki, D. Barbier, pp.13-24. Abstract.
Comparison of porous silicon, porous polysilicon and porous silicon carbide as materials for humidity sensing applications, E.J. Connolly, G.M. O'Halloran, H.T.M. Pham, P.M. Sarro, P.J. French, pp.25-30. Abstract.
Correlation between epitaxial growth conditions of 3C-SiC thin films on Si and mechanical behavior of 3C-SiC self-suspended membranes, C. Gourbeyre, T. Chassagne, M. Le Berre, G. Ferro, E. Gautier, Y.Monteil, D. Barbier, pp.31-34. Abstract.
On the properties and functionality of ultra-thin diamond related protective coatings used in optical systems, M. Gioti, S. Logothetidis, C. Charitidis, Y. Panayiotatos, I. Varsano, pp.35-40. Abstract.
Electrochemical deposition of metal layers and structures for Si-based microsystems, S. Martnez, N. Yaakoubi, A. Perez-Rodrguez, C. Serre, P. Gorostiza, J.R. Morante, J. Esteve, pp.41-44. Abstract.
Rhenium deposition on a silicon surface at the room temperature for application in microsystems, V. Petrovich, M. Haurylau, S. Volchek, pp.45-48. Abstrract.
Copper micromoulding process for NMR microinductors realization, A.-L. Coutrot, E. Dufour-Gergam, J.-M. Quemper, E. Martincic, J.-P.Gilles, J.-P. Grandchamp, M. Matlosz, A. Sanchez, L. Darasse, J.-C.Ginefri, pp.49-54. Abstract.
Structural characterisation of NiTi thin film shape memory alloys, F.M.B. Fernandes, R. Martins, M. Teresa Nogueira, R.J.C. Silva, P.Nunes, D. Costa, I. Ferreira, R. Martins, pp. 55-58. Abstract.
Shape memory thin films with transition above room temperature from Ni-rich NiTi films, N. Frantz, E. Dufour-Gergam, J.P. Grandchamp, A. Bosseboeuf, W.Seiler, G. Nouet, G. Catillon, pp.59-63. Abstract.
PZT thin films integration for the realisation of a high sensitivity pressure microsensor based on a vibrating membrane, E. Defay, C. Millon, C. Malhaire, D. Barbier, pp.64-67. Abstract,
Time effect on the ferroelectric properties of SrBi2Ta2O9 thin films in forming gas processing, T. Yu, D.-S. Wang, D. Wu, A.-D. Li, A. Hu, Z.-G. Liu, N.-B. Ming, pp.68-70. Abstract.
Photoluminescence of Eu-doped titania xerogel spin-on deposited on porous anodic alumina, N.V. Gaponenko, I.S. Molchan, G.E. Thompson, P. Skeldon, A. Pakes, R.Kudrawiec, L. Bryja, J. Misiewicz, pp. 71-73. Abstract.
Conducting polymer films by UV-photo processing, Q. Fang, D.G. Chetwynd, J.W. Gardner, pp.74-77. Abstract.
Fabrication of UV-transparent SixOyNz membranes with a low frequency PECVD reactor, K. Danaie, A. Bosseboeuf, C. Clerc, C. Gousset, G. Julie, pp.78-81. Abstract.
The etching behavior of APCVD PSG thin films used as sacrificial layers for surface micromachined resonant microstructures, M. Modreanu, C. Moldovan, R. Iosub, pp.82-84. Abstract.
Fabrication of capacitive micromechanical ultrasonic transducers by low-temperature process, D. Memmi, V. Foglietti, E. Cianci, G. Caliano, M. Pappalardo, pp.85-91. Abstract.
Experiments for microphotonic components fabrication using Si <1 1 1> etching techniques, D. Cristea, M. Purica, E. Manea, V. Avramescu, pp.92-97. Abstract.
Thermal investigation of micro-filament heaters, P. Furjes, Z. Vizvary, M. Adam, A. Morrissey, C. Ducso, I. Barsony, pp.98-103. Abstract.
Silicon membranes fabrication by wet anisotropic etching, R. Iosub, C. Moldovan, M. Modreanu, pp.104-111. Abstract.
Advanced micromachining processes for micro-opto-electromechanical components and devices, G. D'Arrigo, S. Coffa, C. Spinella, pp.112-118. Abstract.
Micromachining of a silicon multichannel microprobe for neural electrical activity recording, C. Moldovan, V. Ilian, G. Constantin, R. Iosub, M. Modreanu, I.Dinoiu, B. Firtat, C. Voitincu, pp.119-124. Abstract.
Design, fabrication and modeling of solid propellant microrocket-application to micropropulsion, C. Rossi, S. Orieux, B. Larangot, T. Do Conto, D. Esteve, pp.125-133. Abstract.
Miniature transducers based on Si whisker joints, S.S. Varshava, I.P. Ostrovskii, pp.134-136. Abstract.
Void formation and electromigration in sputtered Ag lines with different encapsulations, M. Hauder, J. Gstottner, W. Hansch, D. Schmitt-Landsiedel, pp.137-143. Abstract.
Modern optical measurement station for micro-materials and micro-elements studies, M. Kujawinska, pp.144-153. Abstract.
IR-spectra of waveguides in LiNbO3 obtained by using different melts, M.K. Kuneva, S.H. Tonchev, M. Sendova-Vasileva, D. Dimova-Malinovska, P.A. Atanasov, pp.154-159. Abstract.
Microstructural information from optical properties of LPCVD silicon films annealed at low temperature, M. Gartner, M. Modreanu, C. Cobianu, R. Gavrila, M. Danila, pp.160-164. Abstract.
Micro- and nanomaterials characterization by image correlation methods, D. Vogel, A. Gollhardt, B. Michel, pp.165-171. Abstract.
Characterization of mechanical and thermal properties of thin Cu foils and wires, B. Weiss, V. Groger, G. Khatibi, A. Kotas, P. Zimprich, R. Stickler, B. Zagar. pp.172-182. Abstract.
Generalized fracture mechanical integral concept JG and its application in microelectronic packaging technology, H. B. Ghavifekr, B. Michel, pp.183-187. Abstract.
Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints, S. Wiese, F. Feustel, E. Meusel, pp.188-193. Abstract.
Creep behaviour of lead free and lead containing solder materials at high homologous temperatures with regard to small solder volumes, J. Villain, O.S. Brueller, T. Qasim, pp.194-197. Abstract.
Fracture mechanics of bonding interface: a cohesive zone model, K. Kishimoto, M. Omiya, W. Yang, pp.198-206. Abstract.
The effects of deposition and annealing conditions on crystallographic properties of sputtered barium ferrite thick films, B. Bayard, J.P. Chatelon, M. Le Berre, H. Joisten, J.J. Rousseau, Barbier, pp.207-212. Abstract.
Fatigue study of SrBi"2Ta"2O"9 thin films processed in forming gas, T. Yu, D.-S. Wang, D. Wu, A.-D. Li, Y.-D. Xia, A. Hu, Z.-G. Liu, N.-B. Ming, pp.213-215. Abstract.
Mechanical characterization and reliability study of bistable SiO2/Si membranes for microfluidic applications, C. Malhaire, A. Didiergeorges, M. Bouchardy, D. Barbier, pp.216-219. Abstract.
Role of the i layer surface properties on the performance of a-Si:H Schottky barrier photodiodes, H. Aguas, E. Fortunato, R. Martins, pp. 220-223. Abstract.
Conference Calendar. pp. 224-225.
List of conferences, pp.226-227. |
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