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Vol. 78, Issue 4, April 2007, pp. I-IV




MEMS Based System-on-Chip and System in Package: New Perspectives


Sergey Y. Yurish

International Frequency Sensor Association (IFSA),

Tel: +34 696067716, E-mail: editor@sensorsportal.com


Abstract: Based on modern MEMS technology achievements new sensors systems architecture on the basis on CMOS System-on-Chip or System in Package (known also as Multi-Chip Module) is considered. The SoC consist of MEMS quartz oscillators, MEMS sensors and universal frequency-to-digital converter. It was illustrated how modern MEMS technology make true some past predictions concerning technological and cost factors for moving from the traditional analog (voltage and current) sensor signal domain to the frequency-time signal domain.


Keywords: MEMS technology, sensors systems, system-on-chip, system in package, multi-chip module, MEMS quartz oscillators, MEMS sensors, universal frequency-to-digital converter


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