bullet International Frequency Sensor Association (IFSA) Newsletter

   (ISSN 1726-6017)

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This monthly e-newsletter, written by the editors of Sensors & Transducers Magazine (ISSN 1726-5479), delivers the product and research news you asked for, and updates you on happenings in the sensor science and industry. Who should read this Newsletter ? All who are interested in the newest information and trends in sensors, transducers, MEMS and sensor instrumentation, including DAQ.

 

IFSA Newsletter (ISSN 1726-6017), No.9-10, September-October 2009

Sponsored Links:

 

Bullet In this Issue:

 

1.   Sensors & Transducers Magazine (e-Digest), Vol.109, Issue 10, October  2009

2.   Media Kit 2010

3.   Special Issue on Sensors & Transducers journal on MEMS: from Micro Devices to Wireless Systems, October 2009

4.   Sensors Web Portal Up-dates Briefs

5.   Coming Sensors Related Books

6.   Recently opened job positions and PhD position

7.   Reverse costing analyses: InvenSense IDG-1004 gyroscope and SPM0408 MEMS Microphone

8.   MEMSentry Bulletins: No.43 (August 2009) and No.44 (September 2009)

9.   Subscription

10. Additional Information, Comments, Suggestions

 

Plus lots more information to be found on Sensors Web Portal: http://www.sensorsportal.com

 


Bullet Sensors & Transducers Journal and Magazine (e-Digest), Vol. 109, No. 10,
    October 2009

 

1) Aspects of Gas Sensor´s Modeling and Implementation in a Dynamic Environment

    Hakim Baha, Zohir Dibi, pp.1-12

    [Abstract and Full Page Article Download]

 

2) A Fuzzy-Based Tactile Sensor for Implementation in Specialized Motion of Land Rover

    Badal Chakraborty, K. Rajanna, pp.13-20

    [Abstract and Full Page Article Download]

 

3) Neuro and Fuzzy Computing Approach for the Flow Sensorless Measurement

    R. Kumar, and P. Sivashanmugam, pp. 21-28

    [Abstract and Full Page Article Download]

 

4) Fuzzy Logic Based Set-Point Weighting Controller Tuning for an Internal Model Control
    Based PID Controller

    Maruthai Suresh, Ranganathan Rani Hemamalini, Gunna Jeersamy Srinivasan, pp. 29-42

    [Abstract and Full Page Article Download]

 

5) Adaptive PI Controller for a Nonlinear System

    D. Rathikarani, D. Sivakumar, pp. 43-58

    [Abstract and Full Page Article Download]

 

6) Integration of Fault Detection and Isolation with Control Using Neuro-fuzzy Scheme

    A. Asokan, D. Sivakumar, pp. 59-69

    [Abstract and Full Page Article Download]

 

7) Control Scheme of a Designed Step Climbing Wheeled Robot

    Srijan Bhattacharya, Sagarika Pal, Subrata Chattopadhyay, pp. 70-75

    [Abstract and Full Page Article Download]

 

8) Accurate Fluid Level Measurement in Dynamic Environment Using Ultrasonic Sensor and ν-SVM

    Jenny Terzic, Romesh Nagarajah, Muhammad Alamgir, pp. 76-91

    [Abstract and Full Page Article Download]

 

9) Design of a MEMS Capacitive Comb-drive Micro-accelerometer with Sag Optimization

    B. D. Pant, Lokesh Dhakar, P. J. George and S. Ahmad, pp. 92-107

    [Abstract and Full Page Article Download]

 

10)Remarkable Electromechanical Coupling in the 2–2 Composite Based on Single-domain
     PMN–0.33PT Crystal

    Vitaly Yu. Topolov, Sergei V. Glushanin, Christopher R. Bowen and Anatoly E. Panich, pp. 108-116

    [Abstract and Full Page Article Download]

 

11)Effect on H2S Gas Sensing Performance of Nb2O5 Addition to TiO2 Thick Films

    C. G. Dighavkar, A. V. Patil, S. J. Patil and R. Y. Borse, pp. 117-125

    [Abstract and Full Page Article Download]

 

12)Al2O3- BSST Based Chemical Sensors for Ammonia Gas Sensing

    L. A. Patil, H. M. Baviskar, pp. 126-136

    [Abstract and Full Page Article Download]

 

13)Wireless Telemetry 2.4 GHz for Measurement Occupational Vibration

    Diogo Koenig and Alexandre Balbinot, pp. 137-146

    [Abstract and Full Page Article Download]

 

14)pH Homeostasis Linked with Capacitance Relaxation Phenomena and Electrostrictive Energy
    in Cancer Cells

    T. K. Basak, T. Ramanujam, J. C. Kavitha, Poonam Goyal, Deepali Garg, Arpita Gupta, Suman Halder,
     pp. 147-153

    [Abstract and Full Page Article Download]

 

 

Product and Business News:

Sensors & Transducers journal's cover

 


Bullet Media Kit 2010

 

 

Taking into account a recession reached by a sensor industry due to modern crisis, the IFSA is going to support the sensor industry in this hard time. It means prices reductions for ads services at primary Internet recourse - Sensors Web Portal (http://www.sensorsportal.com). The new Media Kit 2010 is available for download online. New services include press releases and white papers publication. IFSA members and advertising agencies have 10 % discount for all Sensors Web Portal services.

 

Acrobat reader logo Click <here> to download Media Kit 2010 (1.65 Mb)

Media Kit 2010

 

 


Bullet Sensors & Transducers Journal, Vol. 7, Special Issue, October 2009

     MEMS: from Micro Devices to Wireless Systems

 

 

Selected Papers From the 12th Annual NSTI Nanotechnology Conference and Trade Show

May 3rd to 7th at the George R. Brown Convention Center, Houston, Texas, USA

 

Edited by Dr. Elena Gaura and Dr. James P. Brusey

 

Sensors & Transducers journal's cover

 

Special Issue, Vol.7,

October 2009

 

The deadline for articles, press releases and sponsored White Papers for the next  issue of S&T Journal (e-Digest) No.11, Vol.110, November 2009 is 16 November 2009. You can submit your article or press release online. For more information and instructions of preparation click <here>.

 


 

 Bullet Sensors Web Portal Up-Date Briefs

 

News:

Up-dated:


Bullet New Published Sensors Related Books

 

 

Sensors and Control Systems in Manufacturing

by Sabrie Soloman

 

ZigBee Wireless Sensor and Control Network

by Ata Elahi and Adam Gschwender

 

Sensors and Control Systems in Manufacturing book's cover

Publisher: McGraw-Hill Professional

Hardcover: 624 pages

Pubdate: 17 November 2009

ISBN: 007160572X

 

More details ...

ZigBee Wireless Sensor and Control Network book's cover

Publisher: Prentice Hall PTR

Paperback: 288 pages

Pubdate: 19 November 2009

ISBN: 0137134851

 

More details ...

 

 

For more sensors books please visit our Online Bookstore

 

 


Bullet Recently Opened Job Positions at PCB Piezotronics, Inc.

 

1) Acoustics Engineer. PCB has a 40+ year history of growth and innovation and we are one of the world’s pioneers in the field of vibration measurement. We have built a global $100 million dollar annual business that focuses on Total Customer Satisfaction and world-class product quality. Within the last 10 years we have taken calculated steps to expand our market reach into the important and growing field of acoustic measurement, including the acquisition of Larson Davis, a well-established acoustic products supplier, and the launch of a new pre-polarized condenser microphone line. Our goal is to establish our position as the premier microphone supplier in the world.

 

Job Summary & Responsibilities

 

An Acoustics Engineer is well-versed in condenser microphone design and manufacturing. They use their engineering education, background knowledge and experience to take a leadership role in the initiation, scheduling, and execution of product design projects in order to launch into a manufacturing environment.  They work with other Engineers, Supervisors, Planners, Buyers, Manufacturing Technicians, and Sales Representatives in order to learn, improve, and teach new technology, manufacturing processes, test methods, departmental procedures and policies.  In addition, they utilize significant understanding of PCB’s business model, market position, quality and cost goals to not only improve new designs, but to work with other functions to improve internal processes. Further, they create the documentation package to provide the “recipe” for the manufacturing our products.

 

Job Requirements

 

  • 5 plus years experience in precision condenser microphone design.

  • 5 plus years experience in diagnosing and solving manufacturing process issues associated with condenser microphone manufacturing (pre-polarized especially).

  • Significant experience communicating and working with acoustic application engineers and customers.

  • Significant and deep understanding of the principles of operation of condenser microphones; other types of microphone or acoustic measurement experience a plus.

  • Must have ability to apply tools of Lean Manufacturing, Six Sigma, SPC’s, Design of Experiments, Error-Proofing, and Shainin techniques.

 

 

2) Senior Vibration Sensor Design Engineer. PCB has a 40+ year history of growth and innovation and we are one of the world’s pioneers in the field of vibration measurement. We have built a global $100 million dollar annual business that focuses on Total Customer Satisfaction and world-class product quality.

 

Job Summary & Responsibilities

 

A Senior Vibration Sensor Design Engineer is well-versed in high temperature accelerometer design and manufacturing. They use their engineering education, background knowledge and experience to take a leadership role in the initiation, scheduling, and execution of product design projects in order to launch into a manufacturing environment. They work with other Engineers, Supervisors, Planners, Buyers, Manufacturing Technicians, and Sales Representatives in order to learn, improve, and teach new technology, manufacturing processes, test methods, departmental procedures and policies.  In addition, they utilize significant understanding of PCB’s business model, market position, quality and cost goals to not only improve new designs, but to work with other functions to improve internal processes.  Further, they create the documentation package to provide the “recipe” for the manufacturing our products.

 

Job Requirements

 

  • 5 plus years experience in high temperature accelerometer design.

  • 5 plus years experience in diagnosing and solving manufacturing process issues associated with manufacturing high temperature accelerometers.

  • Significant experience communicating and working with high temperature application engineers and customers.

  • Significant and deep understanding of the principles of piezoelectronics.

  • Experience with government and/or aerospace contracts.

  • Must have ability to apply tools of Lean Manufacturing, Six Sigma, SPC’s, Design of Experiments, Error-Proofing, and Shainin techniques.

 

 

3) Greater China Sales Manager.

 

Job Summary & Responsibilities

 

The Greater China Sales Manager is responsible for the operation of PCB’s Beijing and Shanghai Offices, as well as for the management of Mainland China, Hong Kong, and Taiwan distributors. This person ensures compliance with US Government export controls and various customs regulations and PCB corporate shipment and payment terms. Exhibits strong leadership skills, and is instrumental in growth of sales and service in the region. Responsibilities include:

 

  1. Develop annual sales and marketing plans and provides regular feedback on performance. Prepares monthly report to HQ and provides closed loop management system of leads and quotations. Ensure effective communication between China staff and HQ. Lead the team to achieve the goals of the plan.

  2. Recruit, train and manage staff. Travel throughout the region to customers, distributors and direct employees.

  3. Coordinate and deliver seminars, make customer visits and ensure factory support. Develop a concept of customers needs by studying company operations and reviewing its stated needs.

  4. During visits to customer sites, advise customer on use and maintenance of products.

  5. Assist the Divisions in developing or recommending new applications or improvements of products and assists in the pricing of customized products.

  6. Manage distributors/customer visits to HQ.

  7. Manage equipment for tradeshows and arranges for its shipment, as required.

  8. Manage communications of pricing, product and policy updates from Divisions to employees, distributors, and customers.

Job Requirements

 

  • Four year technical degree or equivalent specialized training

  • Eight to ten years of sensor or sensor related experience.  International experience mandatory and may substitute for some of the sensor experience

  • 5 years of leadership/management experience

  • Mandarin Chinese language ability highly preferred

  • Ability to live and work full-time in China

  • Ability to travel heavily

 

About PCB Piezotronics, Inc.

 

PCB Piezotronics, Inc. is a privately owned, high-technology company specializing in the development, production, marketing and sale of piezoelectric, capacitive, silicon and resistive-based instrumentation for measuring pressure, force, torque, load, shock, sound and vibration. These sensors and associated hardware are used for a wide variety of industrial, research, university, aerospace and military applications, ranging from the characterization of underwater blast wave propagation to monitoring micro-g vibrations on the solar panels of orbiting satellites. In essence, any structure that vibrates, pulsates, moves, compresses, surges or makes noise has the potential to be monitored by this instrumentation. We are a dynamic company that is committed to employee training and development, as well as having a world-class compensation and employee benefits package. For more information on our company please visit our website at www.pcb.com. Interested and qualified candidates are encouraged to forward their resume to jobs@pcb.com for immediate consideration.

 

 

For more sensor jobs positions, resume or job position posting please visit our Sensor Jobs section

 

 


Bullet Reverse Costing Analyses

 

 

Analyze the cost of projects at the R&D level Enhance the negotiation power of purchasing managers Benchmark competitor’s products, by System Plus Consulting

 

 

1) InvenSense IDG-1004

 

Based on a complete reverse engineering process the report provides an estimation of the production cost as well as the selling price of the circuit. The IDG-1004 is an integrated dual-axis angular rate sensor (gyroscope). It uses specific InvenSense’s technology with three bonded wafers. The MEMS are manufactured in a thin wafer bonded on an integrated circuit. The sensor is protected by a CAP which allows the MEMS to be integrated in a standard package. All electronics are integrated onto the IC.

 

Click <here> for more details and Order Form download (IFSA special price)

 

 

2) Knowles SPM0408 - MEMS Microphone

 

System Plus Consulting is proud to publish the reverse costing report of the MEMS Microphone SPM0408HE5H supplied by Knowles Acoustics. Mostly used in cell phones, the Knowles MEMS microphones have been shipped at more than 1 billion units since their introduction. They use a specific surface mount designed FR4 type package, containing 2 separate dies: a capacitive MEMS microphone and an ASIC for signal amplification. Since the last generation, several changes have been realized like the use of Deep Reactive Ion Etching for the MEMS cavity instead of traditional KOH etching.

 

Click <here> for more details and Order Form download (IFSA special price)

 

 


Bullet MEMSentry Bulletins

 

Yole Développement publishes this exclusive bulletin analyzing recent events and coming trends in the MEMS fields. This bulletin is published 12 times a year. Free access for payment IFSA Members:

 

 

MEMSentry bulletin No.43, August 2009 MEMSentry bulletin No.43, September 2009

 

Vol.43, August 2009 (2.66 Mb)

 

Vol.44, September 2009 (1.78 Mb)

 

 


Bullet Subscriber Service

 

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Bullet Addition Information

 

1) Our next Newsletter will be published in the mid of November 2009. Interested in sponsoring IFSA Newsletter ? Please contact us mailto: editor@sensorsportal.com

 

2) Do you have comments about this newsletter? Send them to editor@sensorsportal.com

 

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