Bullet Journal: SENSORS AND ACTUATORS A: PHYSICAL

     ISSN: 0924-4247  Vol.151/1

 

 

Date: 8 April 2009

 

1. Editorial Board
Page i
General Section
2. Study of semiconductor electro-optic modulators for sensing extremely-low-frequency electrical signals
Pages 1-8
Ai-ichiro Sasaki, Akinori Furuya, Mitsuru Shinagawa
Physical Section
3. Compact Fourier transform spectrometers using FR4 platform
Pages 9-16
Çağlar Ataman, Hakan Urey
4. A microfabricated electrode with hollow microneedles for ECG measurement
Pages 17-22
L.M. Yu, F.E.H. Tay, D.G. Guo, L. Xu, K.L. Yap
5. Polarization-sensitive surface plasmon enhanced ellipsometry biosensor using the photoelastic modulation technique
Pages 23-28
W. Yuan, H.P. Ho, S.Y. Wu, Y.K. Suen, S.K. Kong
6. Implantable real-time dosimetric probe using GaN as scintillation material
Pages 29-34
Patrick Pittet, Guo-Neng Lu, Jean-Marc Galvan, Jean-Yves Loisy, Anas Ismail, Jean-Yves Giraud, Jacques Balosso
7. Drag force micro solid state silicon plate wind velocity sensor
Pages 35-41
Lidong Du, Zhan Zhao, Cheng Pang, Zhen Fang
Materials and Technology Section
8. Influences of heating temperature on mechanical properties of polydimethylsiloxane
Pages 42-45
Miao Liu, Jianren Sun, Quanfang Chen
Actuator Section
9. Mechanical and actuation behavior of electroactive nanostructured polymers
Pages 46-52
Ravi Shankar, Tushar K. Ghosh, Richard J. Spontak
10. Optimal design of Al/Si bimorph electro-thermal microactuator by integrating finite-element code with optimization method
Pages 53-63
Chin-Hsiang Cheng, Chi-Kang Chan, Guang-Jer Lai
11. Novel application of Joule heating to maintain biocompatible temperatures in a fully integrated electromagnetic cell sorting system
Pages 64-70
Suk-Heung Song, Bong-Seop Kwak, Jae-Sung Park, Woochul Kim, Hyo-IL Jung
12. Fabrication, characteristics and temperature stability of Pb(Mg1/3Nb2/3)O3–Pb(Sb1/3Nb2/3)O3–Pb(Ni1/3Nb2/3)O3–Pb(Zr, Ti)O3 piezoelectric actuators
Pages 71-76
Xiaolian Chao, Zupei Yang, Mingyuan Dong, Gang Li
Technology Section
13. Anodic bonding of glasses with interlayers for fully transparent device applications
Pages 77-80
Piotr Mrozek
14. Effect of nanoscale surface topography on low temperature direct wafer bonding process with UV activation
Pages 81-86
Zirong Tang, Ping Peng, Tielin Shi, Guanglan Liao, Lei Nie, Shiyuan Liu
15. Mold temperature variation for assisting micro-molding of DVD micro-featured substrate and dummy using pulsed cooling
Pages 87-93
Shia-Chung Chen, Ying-Cheih Wang, Sung-Chih Liu, Jin-Chuan Cin

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